CAD-Computer Aided Design:-
It will replace the manual drafting of the design process into automated design, also referred as EDA Electronic Design Automation.
Classifications of PCB:-
Class 1- General electronics product
Class 2- Dedicated service electronics
Class 3- High reliability electronics
It will replace the manual drafting of the design process into automated design, also referred as EDA Electronic Design Automation.
Classifications of PCB:-
Class 1- General electronics product
Class 2- Dedicated service electronics
Class 3- High reliability electronics
PCB Design Process
A design process of the PCB will takes place from library creation to Gerber file generation.
- Input collection
- Data sheet
- BOM
- Library creation
- Schematic capture
- Design rule check
- Net list, Approval
- Layout details
- Major component location
- Placement
- Further requirement of client
- Routing
- Critical signals, Differential pair
- Copper pouring
- Design rule check
- Output files generation
Library creation
"It is creating the part which is required for schematic and layout."
QFN- Quad flat no lead packages.
QFP- Quad flat packages.
BGA- Ball grid array.
SMD-Surface mount device ,It have no through hole leads.
PTH-Plated through hole component, It have through hole leads till to bottom side of the board.
1. Board dimension
Creation process
1. Schematic symbol creation 2. Layout package creation
Types of packages
SOIC- small outline integrated circuit.QFN- Quad flat no lead packages.
QFP- Quad flat packages.
BGA- Ball grid array.
Types of component
SMD-Surface mount device ,It have no through hole leads.
PTH-Plated through hole component, It have through hole leads till to bottom side of the board.
Schematic
" Representing the desired circuit by graphical symbols."
DRC-Design rule check, Approval the schematic as per the design rule check and generate the net list.Placement
"Assigns the component location on the board as per the circuit flow and client requirement."
Placement process
- Importing the board outline.
- Layout area and board shape.
- Mounting hole.
- Import component.
- Placing edge connectors, power supply.
- Major ICs.
- Discrete components.
Routing
"Which defines the whole copper trace pattern for the circuit connectivity on the board."
Routing process
- Layer stack up
- Fan out
- Critical routing
- Differential pair, Address buses, Data buses
- Copper pouring
- Routing clean up
- Design rule check
Output file
- Gerber file
- Md file
- Drill file
Gerber file
"It is a photo file of all the electrical layer and required non-electrical layer of the design."
Generating process
Electrical layer
- All the electrical layer should be generated.
- Gerber file of the electrical layer should contain pad, copper, traces, via of the design by all the signals and all the sizes.
- Also with board shape
Non-Electrical layer
- solder mask layer of component and solder side must.
- silkscreen layer.
- paste mask layer.
- assembly layer.
Master drawing file
"Which contain all manufacture details of the board which is required for the fabricator."
Process
1. Board dimension
2. Layer arrangement
3. Material notes
4. Board issue level
5. Drill hole details
All the dimensions should be mentioned in mm Drill file.
File generated in excellon format which is required to make the drill hole in the board.
0 comments:
Post a Comment