Q. What is The Process Flow For The PCB Manufacturing?

ANSWER:

1. RAW MATERIAL SHEARING.
2. SURFACE PREPARATION.
3. HOT ROLL LAMINATION.
4. LOCATING HOLE DRILLING.
5. INNER LAYER PRINTING.
6. AUTOMATED OPTICAL INSPECTION.( JOBS THAT DO NOT PASS INSPECTION ARE REWORKED IF POSSIBLE, ELSE SCRAPPED )
7. INNER LAYER ETCHING.
8. INNER LAYER RESIST STRIPPING.
9. AUTOMATED OPTICAL INSPECTION.( JOBS THAT DO NOT PASS INSPECTION ARE REWORKED IF POSSIBLE, ELSE SCRAPPED )
10. BLACK OXIDE COATING.
11. LAYER STACKING AND PRESSING.
12. CURING AFTER PRESSING.
13. CNC DRILLING.
14. BOC REMOVAL & DESMEARING.
15. WET DEBURRING.
16. ELECTROLESS COPPER PLATING.
17. SURFACE PREPARATION.
18. HOT ROLL LAMINATION.
19. EXTREME LAYER CIRCUIT.
20. INSPECTION.( JOBS THAT DO NOT PASS INSPECTION ARE REWORKED IF POSSIBLE, ELSE SCRAPPED )
21. PATTERN COPPER AND TIN PLATING.
22. RESIST STRIPPING.
23. ALKALINE COPPER ETCHING.
24. TIN STRIPPING.
25. INSPECTION.( JOBS THAT DO NOT PASS INSPECTION ARE REWORKED IF POSSIBLE, ELSE SCRAPPED )
26. SURFACE PREPARATION.
27. SOLDER MASK(SM) APPLICATION.
28. SM PRINTING & DEVELOPING.
29. BAKING AFTER.
30. HOT AIR SOLDER LEVELING.
31. LEGEND PRINTING AND.
32. ROUTING.
33. FINAL CLEANING.
34. ELECTRICAL TESTING.( JOBS THAT DO NOT PASS INSPECTION ARE REWORKED IF POSSIBLE, ELSE SCRAPPED )
35. FINAL INSPECTION.( JOBS THAT DO NOT PASS INSPECTION ARE REWORKED IF POSSIBLE, ELSE SCRAPPED )
36. DESPATCH.

• RAW MATERIAL SHEARING: 

Shearing is a metal fabricating process used to cut straight lines on flat metal stock. During the shearing process, an upper blade and a lower blade are forced past each other with the space between them determined by a required offset. Normally, one of the blades remains stationary.

• SURFACE PREPARATION:

Preparation of copper surfaces before photo resist for inner and external layers of PCB.

• HOT ROLL LAMINATION:

In hot roll lamination, The resist is heated to lower its viscosity so that it can flow and conform to the substrate surface. Heat is applied to the rolls and transferred through the polyester film cover sheet and the resist to the resist/copper interface.

• LOCATING HOLE DRILLING:

High speed drilling ensures clean hole walls to provide a secure base for good plating on the hole walls. Drilling is a slow process as each hole must be drilled individually. So depending on the drill size we drill a stack of one to three PCB panels together. We can drill holes down to 100 microns in diameter.

Drilling Process 

click on it for watching 

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Er. Ashok Yadav

Hi. I’m Designer of Blog TECHNO. I’m CEO/Founder of TECHNO. I’m Creative Art Director, PCB Designer, Web Designer,Web Developer, Business Enthusiast, StartUp Enthusiast, Speaker, Writer. Inspired to make things looks better.

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