Ans
- Based on Rigidity
- Rigid
- Flexible
- Rigid Flex
- Based on Functions
- Digital
- Analog.
- Microwave
- High Frequency
- Radio Frequency
- Based on Finish :
- Solder Mask On Bare Copper (SMOBC)
- Hot Air Solder Leveled (HASL)
- Gold Plated
- Electro less Nickel & Immersion gold (ENiG)
- Immersion Tin
- Silver Plated
- Immersion Silver
- Organic Solder ability Preservative (OSP)
- Based on Raw Materials:
- Paper Phenolic
- Glass Epoxy
- PTFE
- Ceramic
- Paper Epoxy
- CEM
- Polyamide
- Kevlar
- Cu - I – Cu.
- Based on Thickness of Conductor:
- 2 oz. ( 70 micron Th. Cu.)
- 1 oz. ( 35 micron Th. Cu.)
- ½ oz. ( 18 micron Th. Cu.)
- ¼ oz. ( 9 micron Th. Cu.)
- 1/8oz.( 4.5 micron Th. Cu.)
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